ADHESIVE STRENGTH OF TWO-LAYER METAL COATINGS ON ALUMINUM OXIDE SUBSTRATES
Keywords:
adhesion, ceramics, copper, thermal conductivity, filmAbstract
Adhesion strength depends on many factors: coating technology, film material, substrate material; and may decrease during operation of the finished product. During the operation of power modules, they are subjected to thermal and mechanical loads, including vibration. This leads to the destruction of components from overheating and mechanical damage to the modules. Often the destruction occurs in the structure of the substrateconductive coating. The main reason for this destruction is the low adhesive strength of the metal film to the ceramic base.
Used laboratory installation to test the technology of forming metal coatings and work on testing the technology; study of the obtained samples. Determination of the range of technological modes for the formation of coatings by magnetron sputtering. Determination of technological modes of source operation during copper coating by steam jet deposition, processing of experimental data and issuance of recommendations on the use of work results.
Based on the data obtained during the study, the roughness of the adhesive sublayer of titanium affects the adhesive strength of the conductive layer of copper on the substrate of alumina. The minimum values of roughness Ra <2.0 μm required to achieve maximum values of adhesive strength up to 60 MPa, can be obtained by placing the substrate relative to the magnetron sputtering system at an angle of 90 ° and 180 ° at a distance from the target to the substrate from 25 to 60 mm
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